Semiconductor Equipment Corp. Model 8601 Manual Die Bonder Semiconductor System 153444677213 New in boxes
USD4749.99
USD4771.99
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Description
Semiconductor Equipment Corp. Model 8601 Manual Die Bonder Semiconductor System 153444677213 New in boxes New in boxes Manufacturer HP Part Number 1PC4152A Model Number C4152A UPC 088698229071 SKU 19 80790 Ref 23 116386
Exchange/Return Notes
- We offer a 30-day return/exchange service after receiving.
- Final sale items are not eligible for returns or exchanges.
- To process your return/exchange, please contact us at [email protected]
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